Work package 4: distribution and MPSoC

The main objectives of this work package are:

The first objective will be considered both for on-chip communication (MPSoC) and for communication beyond the chip-level (distributed systems). It will be achieved in three steps which will be investigated in a partially overlapping manner. The second objective will be achieved by providing associated tools and demonstrators.

Main tasks

Key players


In terms of technological development and demonstration, we will set up an environment that enables the validation of the new concepts and methods that are designed. In particular, we will extend the MPARM simulation system that has been built at University Bologna. We will demonstrate the efficiency of the newly developed design methods using simulation-based methods. In addition, it will be possible to compare the analytic worst-case results (predictability) with the intended efficiency.